Product
You are here : Home >> Product >> Heat Sink Series

High-Precision Hermetic Instrument Heat Dissipation Housing

Model number xx-10
Size Customized Dimensions Based on Customer Drawings
Processing method Aluminum Die Castings
Surface treatment
Apply
Request For Quotation
  • Introduce
  • Argument

High-Precision Hermetic Instrument Heat Dissipation Housing

High-Precision Aluminum Die-Cast Heat Dissipation Enclosure

(A High-Efficiency Thermal & Protective Solution for Instruments & Electronic Devices)

Product Core Positioning

This is a dual-function (heat dissipation + protection) high-precision aluminum die-cast enclosure, engineered for precision instruments and electronic devices with high heat generation and reliability requirements. It integrates efficient heat dissipation and structural protection through one-piece die-casting technology.

Key Advantages

1. Superior Heat Dissipation Performance

  • Material & Craftsmanship: Made of 6063-T5 aluminum alloy via die-casting, with a thermal conductivity of 200W/(m·K). Its dense fin structure increases heat dissipation area by 80% compared to standard enclosures;

  • Passive Cooling Design: No fan required—heat is quickly dissipated via natural convection, ideal for sealed or silent scenarios (e.g., outdoor sensors, industrial controllers).

2. High-Precision Structural Protection

  • Die-Casting Precision: Tolerance controlled within ±0.1mm, compatible with the installation of precision circuit boards and components;

  • Environmental Adaptability: Surface treated with anodization/powder coating, achieving IP65 dust/water resistance. It withstands -40℃~85℃ temperature extremes and resists salt spray corrosion for over 500 hours;

  • Mechanical Protection: The enclosure body has a strength of 100MPa, buffering vibration and impact during device transportation and operation.

3. Flexible Adaptability

  • Customizable Dimensions: Supports size, mounting hole, and fin density customization based on customer drawings;

  • Multi-Scenario Compatibility: Suitable for high-precision instruments, LED drivers, communication modules, industrial control equipment, and other products requiring heat dissipation and protection.

Application Value

  • Extends the lifespan of core device components (3x longer lifespan in high-temperature environments);

  • Replaces the traditional "plastic case + independent heat sink" solution, reducing assembly processes and lowering overall costs;

  • Meets the strict requirements of precision instruments for "lightweight, compact, and high reliability" (only 1/3 the weight of a steel enclosure of the same size).


Thank you for coming

WhatsApp

+852-60892422