Product

Heat sink housing for micro devices

Model number xx-19
Size
Processing method Die Casting Part +CNC
Surface treatment
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  • Argument

As the outer frame of the heat sink, it encloses the internal heat dissipation fins/fan, guides the directional flow of air, and improves heat dissipation efficiency (commonly used in small electronic devices, industrial controllers, micro-motors, etc.).

The corrugated/layered structure in the figure not only enhances the structural strength of the housing but also helps to dissipate heat, cooperating with internal heat dissipation components to achieve temperature control of the equipment.


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